安徽华威铜箔科技有限公司

安徽华威铜箔科技有限公司

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HVLP High Frequency High Speed Very Low Profile Copper Foil WW-HVLP
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HVLP High Frequency High Speed Very Low Profile Copper Foil WW-HVLP
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HVLP High Frequency High Speed Very Low Profile Copper Foil WW-HVLP

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Product description
Parameters

The HVLP high frequency and high speed copper foil produced by self-developed additives has the following characteristics: equiaxial fine crystalline spherical layer with extremely low profile (profile height can be customized), and also has high strength, high conductivity, high elongation, high heat resistance, high temperature oxidation resistance, impregnability, copper bud fine, no copper powder transfer.

The grain structure of the raw foil is controlled by the raw foil anode groove at the front end, and the nodular fine particles and flat processing technology make the product achieve high consistency. The extremely low surface profile effectively reduces the loss of the signal after the PCB is made, so that the signal is still intact in the high frequency band; HVLP has an annual production capacity of 20,000 tons of extremely low profile copper foil products.

Product application

● High frequency high speed copper clad plate

● IC seal loading plate

● High Density Interconnect Technology Board (HDI)

Main parameterCrystal structure

Product thickness (μm)

7 9 12 18 35 70

Pass area ratio(g/㎡)

62±2 80±2 107±3 153±4 285±8 610±10

Tensile strength (MPa)

Normality

≥300
180℃ ≥190

Extensibility (%)

Normality

≥8 ≥10 ≥11 ≥13 ≥16 ≥16
180℃ ≥8 ≥10 ≥11 ≥13 ≥16 ≥16

Roughness Rz (μm)

WW-HVLP-1 Treatment surface(M) >1.5 and <2.0
WW-HVLP-2 Treatment surface(M) >1.0 and ≤1.5

Peel strength (lb/in)

Normality

≥3.5 ≥3.5 ≥3.5 ≥4 ≥4 ≥4
288℃ (Dip tin 3 times for 10 seconds) ≥3 ≥3 ≥3 ≥3.5 ≥3.5 ≥3.5

Antioxidation 200℃ 60min

Non-oxidation

  *The above tests are carried out in accordance with IPC-TM-650 execution standards, in which the peel strength test adopts the typical value of NPG-170D semi-curing pressing of the substrate of Nana New material M4 grade, without guarantee value.

 

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