RTF Inverts Ultra-Low Profile Copper Foil WW-RTF

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Product description

Parameters

WW-RTF has the characteristics of low profile, high flatness, high dimensional accuracy, strong thermal stability, double-sided conductivity, good weldability and good electromagnetic shielding effect.

The double-sided low profile helps to reduce the contact resistance of the internal circuit of the electronic device and improve the stability and reliability of the circuit connection. Excellent double-sided conductivity can be used for more complex circuit designs and higher circuit layout efficiency; Good welding performance suitable for different types of electronic component assembly; By coating the surface of the organic film, the internal stress of the copper foil is evenly distributed, and the stability and reliability of the material are improved. The annual production capacity of RTF inversion copper foil products can reach 20,000 tons.

Product application

● High frequency high speed copper clad plate

● Flexible Printed Circuit Board (FPC)

● High Density Interconnect Technology Board (HDI)

Main parameter

Product thickness(μm)			7	9	12	18	35	70
Mass arearatio(g/㎡)			62±2	80±2	107±3	153±4	285±8	610±10
Tensile strength (MPa)	Normality		≥300
	180℃		≥190
Extensibility (%)	Normality		≥8	≥10	≥11	≥13	≥18	≥18
	180℃		≥8	≥10	≥11	≥13	≥18	≥18
Roughness Rz (μm)	WW-RTF-3	S-surface	>1.5and≤2.0
		M-surface	>1.5and≤2.0
	WW-RTF-4	S-surface	>1.0 and ≤1.5
		M-surface	>1.0 and ≤1.5
Peel strength (lb/in)	Normality		≥3.5	≥3.5	≥3.5	≥4	≥4	≥4
	288℃(Dip tin 3 times for 10 seconds)		≥3	≥3	≥3	≥3.5	≥3.5	≥3.5
Antioxidation 200℃*60min			Non-oxidation

　　*The above tests are carried out in accordance with IPC-TM-650 execution standards, in which the peel strength test adopts the typical value of NPG-170D semi-curing pressing of the substrate of Nana New material M4 grade, without guarantee value.